What's included in this Whitepaper?
Engineered using advanced wrought powder technology, our heat spreader materials deliver superior thermal conductivity. Molybdenum offers excellent thermal conductivity, while copper’s exceptional heat transfer efficiency makes it highly effective for dissipating heat.
Our composites are trusted in high-temperature applications, including heat sinks, pedestals, thermal spreaders, and base plates. Our composites are the material of choice for Gallium Arsenide (GaAs) and Gallium Nitride (GaN) semiconductors, used in applications such as microwave packages and high RF systems.
Our materials are stamped, machined, and plated and offer exceptional controlled thermal expansion up to 400°C for precise requirements.
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